PC and computing power field - liquid cooling heat dissipation structure

Primarily applied to design-oriented and computing power-oriented computers, solving the heat dissipation issues of high-power CPUs and computing power GPUs.

The design incorporates high-flow water channels combined with fans and liquid circulation pumps. The 360 ARGB all-in-one liquid cooler features an innovative hidden water pipe design, maximizing simplicity and aesthetics. The 6.67-inch AMOLED high-definition curved display supports naked-eye video or customizable system information. Pre-installed fans in a daisy-chain setup allow for front and side lighting effects, making the liquid inside the case vibrant. This significantly enhances performance and ensures effective cooling.

In the field of large-scale computing servers, there is a separated liquid cooling heat dissipation structure.

Primarily used in various server types and large-scale computing servers that require heat dissipation separation.

Currently, computing is transitioning towards intelligent computing, and the high demand for computing power is driving the development of mainstream computing power chips. As a result, the power consumption of computing power chips is also continuously increasing, approaching the limit of air-cooling single-point cooling. Traditional air-cooling technology can no longer meet the liquid cooling and continuous development needs of high-power, high-density data centers. Solving server cooling issues, improving stability, reducing PUE, and achieving low-carbon energy saving are necessary.

Laser lights and medical fields - liquid cooling heat dissipation structure

Primarily applied to products and fields with high laser and central thermal intensity.

refineries process crude oil by thermal cracking and produce liquid fuels of different densities, properties and functions. Refining residues are also reprocessed according to their type, actual needs and local regulations. The petrochemical industry reduces the corrosivity and impurities of oil and natural gas through filtration and processing, and produces the required chemicals and synthetic materials through complex and professional processing.

Illumination field - fin heat dissipation structure

Widely applied in outdoor high-power high-pole lights, stage lighting, laser lights, and other fields.

The product uses a heat pipe with fin attachment welding process for cooling. The fin heat pipe active cooling technology combines the dual advantages of enhanced conduction and optimized convection. It quickly conducts heat from the heat source to the fin array via the heat pipes, and then dissipates the heat through forced convection using fans, achieving maximum cooling efficiency. This technology combination is particularly suitable for outdoor high-power lighting scenarios, effectively solving the thermal management issues of LED lamps over 100W. Compared to traditional passive cooling solutions, the active cooling system can reduce the chip junction temperature by 20-30°C, extend the LED lifespan by 2-3 times, and also allows for more compact product designs, reducing weight by over 40%.